Resources · Blog
Hiring Intel for Engineering Teams
Market analysis, hiring strategy, and engineering insights from the team that places mid, senior, and principal engineers at Fortune 500 semiconductor companies.

Jul 30, 2026
Health Insurance and Benefits for Contract Engineers: What Your Options Actually Are
COBRA, ACA, or W2 with benefits? A clear breakdown of health insurance options and real costs for mid to principal-level contract engineers.
By Jason Eisenberg

Jul 29, 2026
The DO-254 FPGA Bottleneck Isn’t Skill, It’s Clearance
Why cleared, DO-254-qualified FPGA talent is scarce, and how to hire DAL-A engineers for defense and rad-hard programs without stalling your schedule.
By Game 7 Staff

Jul 23, 2026
How to Hire a High-Speed PCB Engineer (4-Layer Skills Won't Cut It)
A 40-layer 112G board is a different profession than a 4-layer shield. How to hire the high-speed PCB and signal-integrity engineer your product needs.
By Game 7 Staff

Jul 21, 2026
How to Hire an Embedded Firmware Engineer Who Can Bring Up Silicon
Bare-metal, RTOS, BSP, safety-critical: 'embedded' covers very different jobs. How to scope and hire the firmware engineer your bring-up actually needs.
By Game 7 Staff

Jul 17, 2026
How to Hire a DFT Engineer (and Tell an Architect From an Operator)
DFT decides your per-unit test cost before floorplan. How to hire a scan/ATPG engineer or a true DFT architect, and tell the difference on a resume.
By Game 7 Staff

Jul 16, 2026
How to Hire a Design Verification Engineer Without Drowning in Resumes
Verification is the biggest team on your chip and the hardest to screen. How to hire a UVM or formal DV engineer who matches your coverage scope, fast.
By Game 7 Staff

Jul 14, 2026
The STA Engineer Who Owns Signoff: Why Timing Closure Talent Is Scarce
Static timing analysis gates every tape-out. What a signoff-level STA engineer owns, the PrimeTime/MMMC depth to look for, and how to hire one.
By Game 7 Staff

Jul 10, 2026
Timing Closure at 3nm: What Separates a Principal Physical Design Engineer
Closing timing on a full-chip tape-out at 3nm is a different job than block P&R. What advanced-node physical design demands and who can do it.
By Game 7 Staff

Jul 8, 2026
Staffing the AI Accelerator Tape-Out: The Roles That Gate Your Schedule
AI chip schedules slip on a handful of roles: SerDes, HBM PHY, verification, DFT, physical design. Here's where the talent bottlenecks actually are.
By Game 7 Staff

Jul 6, 2026
Why a 112G SerDes Designer Is the Hardest Analog Hire in Semiconductor
112G/224G SerDes designers are the scarcest analog talent in semiconductor. Why they're so hard to hire, and how to find one who's silicon-proven.
By Game 7 Staff

Jul 2, 2026
American Chip Independence Has a Bottleneck, and It Isn’t the Fab
This Fourth of July, the scarcest thing in American silicon isn’t a building. It’s the engineers who design what the building prints.
By Jason Eisenberg

Jun 30, 2026
How to Evaluate a Semiconductor Staffing Firm Before You Sign Anything
Five questions that separate semiconductor staffing specialists from resume forwarders, plus the red flags worth walking away from. A buyer's guide.
By Jason Eisenberg
